Allied Diamond Cutting Blade

 

ALLIED Wafering Blades

Wafering (ultra thin) blades are available in Bonded, Plated, or Solid Core configurations with Diamond, CBN (cubic boron nitride), Aluminum Oxide or Silicon Carbide mineral. They are recommended for precision sectioning or when kerf (cut width) loss needs to be kept to a minimum.

Bonded Blades

Bonded blades are composed of an inner metal core and an outer rim. The rim consists of either metal or resin mixed with abrasive, cured under high temperature and pressure to bond the matrix together. Metal bonding offers long life and durability, while resin bonding creates less heat, provides better surface finish and is well suited for cutting hard, delicate or brittle materials.

Diamond, Metal Bond - High Concentration

Recommended for general laboratory sectioning, either low or high speeds.

Item No. Description 60-20065 3" x .006" x �"   60-20070 4" x .012" x �"   60-20075 5" x .015" x �"   60-20080 6" x .020" x �"   60-20081 7" x .025" x �"   60-20084 8" x .030" x �"

Diamond, Metal Bond - Low Concentration

Recommended for sectioning very hard or brittle materials such as ceramics, silicon, glass and refractories where chipping and pullout need to be kept to a minimum. Used at low or high speeds.

Item No. Description 60-20085 3" x .006" x �"   60-20090 4" x .012" x �"   60-20095 5" x .015" x �"   60-20100 6" x .020" x �"   60-20101 7" x .025" x �"   60-20104 8" x .030" x �"

제품에 대한 문의사항이 있으시면 아래 e-mail, 전화 문의 바랍니다.

MSE : 02-2275-9510     팩스 : 02-2278-5446 

msescy@hanmail.net  http://semims.com