Diamond Blade
4"Dia x 0.3 mmx0.5" arbor Impregnated Diamond Cutting Blades For Cutting Saw - EQ-IPDB40305
3"Dia x 0.2 mm x0.5" arbor Fully Sintered Diamond
Cutting Blades For Low Speed Saw - EQ-DF0302
4 "Dia x 0.35 mm t x 0.5" arbor Edge Sintered Diamond Blades - EQ-DB-153742
5" Dia x 0.020" t x 0.5" arbor Edge
SIntered Diamond Blade - EQ-DB-153739
6 "Dia x 0.014" t x 0.5" arbor Edge Sintered Diamond Blades - EQ-DB-153744
ALLIED Wafering Blades
Wafering (ultra thin) blades are available in Bonded, Plated, or Solid Core configurations with Diamond, CBN (cubic boron nitride), Aluminum Oxide or Silicon Carbide mineral. They are recommended for precision sectioning or when kerf (cut width) loss needs to be kept to a minimum.
Diamond, Metal Bond - High Concentration | ||||||||||||||||||||||||||||
Recommended for general laboratory sectioning, either low or high speeds. | ||||||||||||||||||||||||||||
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Diamond, Metal Bond - Low Concentration | |||||||||||||||||||||||||
Recommended for sectioning very hard or brittle materials such as ceramics, silicon, glass and refractories where chipping and pullout need to be kept to a minimum. Used at low or high speeds. | |||||||||||||||||||||||||
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