Silicon Wafer

 

Silicon Wafer

 

2 inch wafer

Parameter	Characteristic	ASTM Control Method
Type/Dopant	P, Boron N, Phosphorous N, Antimony N, Arsenic	F42
Orientations	<100>, <111> slice off orientations per customer’s specifications	F26
Oxygen Content	10-20 ppmA Custom tolerances per customer’s specification	F121
Carbon Content	0.5 – 1.0 ppmA Custom tolerances per customer’s specification	F123
Resistivity ranges- P, Boron- N, Phosphorous- N, Antimony   - N, Arsenic	0.001 – 50 ohm cm 0.1 – 40 ohm cm 0.005 – 0.025 ohm cm < 0.005 ohm cm	F84

 

Mechanical Properties

Parameter	Prime	Monitor/ Test A	Test	ASTM Method
Diameter	2″ ± 0.008″	2″ ± 0.008″	2″ ± 0.015″	F613
Thickness	279 ± 20 µm (standard)	279 ± 25 µm (standard) 381 ± 25 µm 450 ± 25 µm 500 ± 25 µm 1000 ± 25 µm	279 ± 25 µm (standard)	F533
TTV	< 5 µm	< 10 µm	< 15 µm	F657
Bow	< 38 µm	< 38 µm	< 38 µm	F657
Wrap	< 38 µm	< 38 µm	< 38 µm	F657
Edge Rounding	SEMI-STD			F928
Marking	Primary SEMI-Flat only, SEMI-STD Flats			F26, F671

 

Surface Quality

Parameter	Prime	Monitor/ Test A	Test	ASTM Method
Front Side Criteria
Surface condition	Chemical Mechanical Polished	Chemical Mechanical Polished	Chemical Mechanical Polished	F523
Surface Roughness	< 2 A°	< 2 A°	< 2 A°
Contamination,Particles @ >0.3 µm	≤ 15	≤ 15	≤ 15	F523
Haze, Pits, Orange peel	None	None	None	F523
Saw Marks, striations	None	None	None	F523
Back Side Criteria
Cracks, crowsfeet, saw marks,stains	None	None	None	F523
Surface condition	Caustic etched

 

3 inch wafers

Parameter	Characteristic	ASTM Control Method
Type/Dopant	P, Boron N, Phosphorous N, Antimony N, Arsenic	F42
Orientations	<100>, <111> slice off orientations per customer’s specifications	F26
Oxygen Content	10-18 ppmA Custom tolerances per customer’s specification	F121
Carbon Content	< 0.6 ppmA Custom tolerances per customer’s specification	F123
Resistivity ranges- P, Boron- N, Phosphorous- N, Antimony- N, Arsenic	0.001 – 50 ohm cm 0.1 – 40 ohm cm 0.005 – 0.025 ohm cm < 0.005 ohm cm	F84

 

Mechanical Properties

Parameter	Prime	Monitor/ Test A	Test	ASTM Method
Diameter	3″ ± 0.008″	3″ ± 0.008″	3″ ± 0.02″	F613
Thickness	381 ± 20 µm (standard)	381 ± 25 µm (standard) 250 ± 25 µm 635 ± 25 µm 1000 ± 25 µm 1300 ± 25 µm	381 ± 50 µm (standard)	F533
TTV	< 5 µm	< 10 µm	< 15 µm	F657
Bow	< 30 µm	< 30 µm	< 40 µm	F657
Wrap	< 30 µm	< 30 µm	< 40 µm	F657
Edge Rounding	SEMI-STD			F928
Marking	SEMI-STD Flats, Primary SEMI-Flat only			F26, F671

 

100mm wafers

Parameter	Characteristic	ASTM Control Method
Type/Dopant	P, Boron N, Phosphorous N, Antimony N, Arsenic	F42
Orientations	<100>, <111> slice off orientations per customer’s specifications	F26
Oxygen Content	10-18 ppmA Custom tolerances per customer’s specification	F121
Carbon Content	< 0.5 ppmA Custom tolerances per customer’s specification	F123
Resistivity ranges- P, Boron- N, Phosphorous- N, Antimony- N, Arsenic	0.001 – 50 ohm cm 0.1 – 40 ohm cm 0.005 – 0.025 ohm cm < 0.005 ohm cm	F84

 

Mechanical Properties

Parameter	Prime	Monitor/ Test A	Test	ASTM Method
Diameter	100 ± 0.2 mm	100 ± 0.2 mm	100 ± 0.5 mm	F613
Thickness	525 ± 20 µm (standard)	525 ± 25 µm (standard) 381 ± 25 µm 625 ± 25 µm 700 ± 25 µm 800 ± 25 µm 1000 ± 25 µm 1500 ± 25 µm	525 ± 50 µm (standard)	F533
TTV	< 5 µm	< 10 µm	< 15 µm	F657
Bow	< 30 µm	< 30 µm	< 40 µm	F657
Wrap	< 30 µm	< 30 µm	< 40 µm	F657
Edge Rounding	SEMI-STD			F928
Marking	SEMI-STD Flats, Primary SEMI-Flat only			F26, F671

 

Surface Quality

Parameter	Prime	Monitor/ Test A	Test	ASTM Method
Front Side Criteria
Surface condition	Chemical Mechanical Polished	Chemical Mechanical Polished	Chemical Mechanical Polished	F523
Surface Roughness	< 2 A°	< 2 A°	< 2 A°
Contamination,Particles @ >0.3 µm	≤ 20	≤ 20	≤ 30	F523
Haze, Pits, Orange peel	None	None	None	F523
Saw Marks, striations	None	None	None	F523
Back Side Criteria
Cracks, crowsfeet, saw marks,stains	None	None	None	F523
Surface condition	Caustic etched

150mm wafers Parameter Characteristic ASTM Control Method Type/Dopant P, Boron N, Phosphorous N, Antimony N, Arsenic F42 Orientations <100>, <111> slice off orientations per customer’s specifications F26 Oxygen Content 10-19 ppmA Custom tolerances per customer’s specification F121 Carbon Content < 0.6 ppmA F123 Resistivity ranges- P, Boron- N, Phosphorous- N, Antimony   - N, Arsenic 0.001 – 50 ohm cm 0.1 – 40 ohm cm 0.005 – 0.025 ohm cm < 0.005 ohm cm F84   Mechanical Properties Parameter Prime Monitor/ Test A Test ASTM Method Diameter 150 ± 0.2 mm 150 ± 0.2 mm 150 ± 0.5 mm F613 Thickness 675 ± 20 µm (standard)   675 ± 25 µm (standard) 450 ± 25 µm 625 ± 25 µm 1000 ± 25 µm 1300 ± 25 µm 1500 ± 25 µm 675 ± 50 µm (standard)   F533 TTV < 5 µm < 10 µm < 15 µm F657 Bow < 30 µm < 30 µm < 50 µm F657 Wrap < 30 µm < 30 µm < 50 µm F657 Edge Rounding SEMI-STD F928 Marking Primary SEMI-Flat only, SEMI-STD Flats Jeida Flat, Notch F26, F671   Surface Quality Parameter Prime Monitor/ Test A Test ASTM Method Front Side Criteria Surface condition Chemical Mechanical Polished Chemical Mechanical Polished Chemical Mechanical Polished F523 Surface Roughness < 2 A° < 2 A° < 2 A° Contamination,Particles @ >0.3 µm ≤ 20 ≤ 20 ≤ 30 F523 Haze, Pits, Orange peel None None None F523 Saw Marks, striations None None None F523 Back Side Criteria Cracks, crowsfeet, saw marks,stains None None None F523 Surface condition Caustic etched   silicon ingot ▶ Product: silicon ingot ▶ Manufacturing method: CZ or FZ method  ▶ Specification Diameter From 50mm up to 300mm Grade Prime / Test / Dummy Type P(Boron) / N(Phos) Orientation 100, 110, 111 Length Order made Resistivity Order made

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